點(diǎn)膠機(jī)產(chǎn)品

桌上型步進(jìn)點(diǎn)膠機(jī) Desktop Step Dispensing Robot

發(fā)布時間：2024-11-02 瀏覽量：29

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技術(shù)參數(shù) Specifications

型號(Model)	BY-300ED	BY-400ED	BY-500ED
工作范圍（Work Area）	300(X)╳300(Y)╳100(Z)mm	400(X)╳400(Y)╳100(Z)mm	500(X)╳500(Y)╳100(Z)mm
外觀尺寸(Size)	490(L)528(W)679(H)mm	590(L)628(W)679(H)mm	690(L)728(W)679(H)mm
最大負(fù)載Y/Z(Max load)	7kg/3kg
最大空移速度(Travel speed)	400mm/sec(XY)/200mm/sec(Z)
軸傳動方式(Drive mode)	步進(jìn)馬達(dá)+皮帶+精密直線導(dǎo)軌(Stepping motor+belt+precise linear guide rail)
XYZ定位精度(Repeatability )	±0.03mm
程序儲存容量(Program capacity)	999個參數(shù)文件(每個文件65535點(diǎn))(999 parameter files(65535 points per file))
操作系統(tǒng)(Operation system )	液晶面板/手持式編程器(LCD panel /Teach pendant)
馬達(dá)系統(tǒng)(Motor)	日本精密步進(jìn)馬達(dá)(Japan micro stepping motor)
運(yùn)動模式(Movement pattern)	3軸點(diǎn)到點(diǎn)、連續(xù)直線、圓孤(3 axis point to point,continuous line, arc)
擴(kuò)展IO(I/O signal ports)	4輸入/4輸出(4 inputs/4 outputs)
輸入電源(Power supply)	AC220V 50/60Hz 0.5kw
工作環(huán)境(Work condition)	溫度0-40℃ 相對溫度20-90%(Temperature 0-40℃;humidity 20-90%)
重量(Weight)	35kg(About35kg)	45KG(About45KG)	55KG(About55KG)

應(yīng)用Application
1.適用流體點(diǎn)膠，例如： UV膠、AB膠、EPOXY(黑膠)、白膠、EMI導(dǎo)電膠、SILICON、環(huán)氧樹脂、瞬間膠、
銀膠、紅膠、錫膏、散熱膏、防焊膏、透明漆、螺絲固定劑等；
It is applied to fluid dispensing, such as, UV glue, AB glue,COB(black glue), white glue, EMI conductive
glue, silicon, epoxy resin, instant glue, silver glue, red glue, paste, thermal grease, welding control paste,
transparent paint, screw fixative and so on.
2.應(yīng)用于PCB電子配件固定及保護(hù)，手機(jī)、筆記本外殼粘接，LCD玻璃，LED點(diǎn)膠，雙攝像頭點(diǎn)膠與封裝，指紋模組點(diǎn)膠，汽車配件涂覆，芯片綁定，電池封裝，喇叭點(diǎn)膠，SMT底部填充、元件封裝、點(diǎn)錫膏、點(diǎn)紅膠、點(diǎn)黑膠、半導(dǎo)體封裝、晶元固定等
Applied to PCB electronic accessories fixed and protection, and mobile phone, notebook shell adhesive, LCD glass, LED point glue, dual cameras dispensing with encapsulation, fingerprint module point glue, auto parts coated, chip binding, battery encapsulation, horn point glue, SMT at the bottom of the filling, packaging, dispensing, points the red plastic, vinyl, semiconductor packaging, wafer fixed and etc .

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